Our Technology
Semiconductor technologies
Microchip Lab leads the way in semiconductor technologies, offering innovative solutions to optimize chip dimensions, enhance performance, and accelerate time-to-market. We ensure superior results for our clients in a rapidly evolving industry landscape.
Wafer Level Interconnect Module (WLIM©)
Introducing WLIM©, a ground breaking process architecture enabling a package less approach to device manufacturing at the front end foundry. Our patented, pre-fabricated interconnect wafers, eliminate the need for TSV processes at back end packaging houses. Contact us today to learn more about this innovative solution.
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Micro Etching & Embossing (MEE©)
MEE© is a breakthrough in glass microfabrication that allows you to produce microfeatures on glass using a scalable, reliable and mass producible process. Contact us today to know more on how our MEE© process can make glass as easily mass manufacturable as Silicon and as cost effective as polymers !
